MicroLab 35 is designed for the fast creation of grinding patterns of contacts up to a diameter of 3 mm. The fully automated transport system and the tried-and-tested technology facilitate short processing times. The parallel processes allow the continuous creation of one grinding pattern per minute. Laser-supported, the sample is clamped quickly, hence defining the grinding surface precisely. Without repositioning, MicroLab 35 grinds the sample on its own. As soon as it has reached the analysis unit, it is electrolytically cleaned, the grinding pattern is recorded and analysed.
|Wire range diameter||dia. 0.30–3.00 mm|
|Cross section range||0.08–6.00 mm²|